The Next-Generation Microelectronics Manufacturing program, known as NGMM, aims to unlock accessible prototyping for the chips of tomorrow with a new agreement to establish the first-ever national center for advancing U.S.-based microelectronics manufacturing.
DARPA will work with the University of Texas at Austin and its existing Texas Institute for Electronics research center to establish a consortium to support 3D heterogeneous integration (3DHI) microsystems research, development and low-volume production. Building on the program’s Phase 0 foundational research, NGMM’s next two phases focus on a domestic capability that comprehensively addresses key challenges and strengthens U.S. technological leadership and innovation.
“We’re holistically addressing tomorrow’s challenges and solutions. That starts with an onshore, open-access center for 3DHI microsystems prototyping and pilot line manufacturing,” said Dr. Whitney Mason, director of DARPA’s Microsystems Technology Office. “This accessibility to researchers from academia, government and industry will break down silos and foster an ecosystem that enhances the U.S. competitive advantage.”
The consortium will leverage partnerships spanning organizations – across the defense industrial base, domestic foundries, vendors and startups, designers and manufacturers, members of academia and other stakeholders – to achieve a shared vision of national and economic security.
DARPA’s work in microelectronics R&D align with, but are separate from, broader government initiatives to secure microchip supply chains. NGMM is funded by the Defense Department budget, rather than the CHIPS and Science Act of 2022 aimed at near-term domestic semiconductor manufacturing. However, cross-collaboration remains integral to building onshore capacity. For DOD, that includes programmatic investment in over-the-horizon technologies for both national security and commercial applications – a key goal for NGMM.
“We can’t overstate need for constant and unwavering forward momentum in microelectronics capabilities. The CHIPS Act’s near-term emphasis can help reinforce NGMM’s work toward realizing the next major wave of microelectronics innovation,” Mason said. “Supply chain resilience and reducing overseas reliance requires working together as a community, with both traditional and non-traditional members. That’s what this program is about.”
